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Product DescriptionCompany Info.<>
- Model:
- TS560
- Processing customization:
- No
- Types:
- Refrigeration equipment for production
- Use:
- High and low temperature temperature test
- Overall dimension:
- 620mm*1000mm*1060mm
- Weight:
- 250 kg
- Scope of application:
- Chips, microelectronic devices, integrated circuits
(Prices on this page are for reference, please refer to the actual quotation)
zonglen TS 560 High and Low Temperature Impact Airflow Tester Cold and Hot Impact TesterTS560
The ThermoTST TS560 is a precision high and low temperature shock airflow meter with a wider temperature range of-70℃ to +225℃, providing very advanced temperature conversion testing capabilities. The temperature conversion from-55℃ to +125℃ is about 10 seconds; after long-term multi-working condition verification, it meets the requirements of various production environments and engineering environments. TS560 is purely mechanical refrigeration and does not require liquid nitrogen or any other consumable refrigerant.
characteristic
The temperature change rate is fast, about 10 seconds between-55℃ and +125℃
Effective temperature range,-70℃ to +225℃
Compact, mobile design
Touch screen operation, man-machine interaction interface
Fast DUT Temperature Stabilization Time
Temperature control accuracy 1℃, display accuracy 0.1℃
Air flow up to 18SCFM
Defrost design, quickly remove internal moisture accumulation
use
Product characteristic analysis, high and low temperature change test, temperature shock test, failure analysis and other reliability tests, such as:
Chips, microelectronic devices, integrated circuits
(SOC, FPGA, PLD, MCU, ADC/DAC, DSP, etc.)
Flash, UFS, eMMC
PCBs, MCMs, MEMS, IGBTs, sensors, small module assemblies
Optical communication (such as: Transceiver high and low temperature test, SFP optical module high and low temperature test, etc.)
Other electronic industries, aerospace new materials, laboratory research
- Name（chinese）
- Name（English）
- Chengdu ZongLen Technologies Co., Ltd
- China credit code
- Identity Verification
- Registered Capital
- 1,000,000 CNY
- Operating term
- 2019-10-18 ~ ****
- Address
-
Pi County, Chengdu, Sichuan, China
- Nearby port
- Shenzhen,Guangzhou
Chengdu ZongLen Technologies Co., Ltd., headquartered in Chengdu, China, is a professional pan conductor high and low temperature intelligent equipment enterprise,with refrigeration and semiconductor divisions. We have successively obtained multiple certifications and honors, including national high-tech enterprise, specialized and innovative enterprise, national level science and technology enterprise, EU CE certified enterprise, ISO9001 international quality management system certified enterprise, and intellectual property standard certified enterprise.- Name（chinese）
- Name（English）
- Chengdu ZongLen Technologies Co., Ltd
- China credit code
- Identity Verification
- Registered Capital
- 1,000,000 CNY
- Operating term
- 2019-10-18 ~ ****
- Address
-
Pi County, Chengdu, Sichuan, China
- Nearby port
- Shenzhen,Guangzhou
Chengdu ZongLen Technologies Co., Ltd., headquartered in Chengdu, China, is a professional pan conductor high and low temperature intelligent equipment enterprise,with refrigeration and semiconductor divisions. We have successively obtained multiple certifications and honors, including national high-tech enterprise, specialized and innovative enterprise, national level science and technology enterprise, EU CE certified enterprise, ISO9001 international quality management system certified enterprise, and intellectual property standard certified enterprise. -
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