Thermo Chuck ATC860-Chuck

The wafer tray system is used for characterization testing, modeling, process development, design debugging, de-BUG or IC fault analysis of semiconductor wafers, with all the performance and versatility required for major analytical probe station integration.

Thermo Chuck ATC860-Chuck

For analytical and production test applications that require rapid temperature changes, cool down and heat up times are particularly important for wafer testing. The temperature conversion rate is much faster than traditional systems based on water or air.

Thermo Chuck ATC860-Chuck Key Features:      

· low noise

· Temperature ranges from-60 C to +175 C,

· Rapid cooling/heating rates up to 25 C/min

· No need for LN2, CO2, reduced costs

· No need to configure the chiller

· Temperature stability 1 C

· Small size for easy integration

· maintenance-free

Thermo Chuck ATC860-Chuck Applications:

· probe station

· Hot and cold platform

· Low Profile Devices, Characterization Testing of Flat Surface Devices

· Wafer testing of power devices