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Product DescriptionCompany Info.<>
- Model:
- TS780
- Processing customization:
- No
- Structure type:
- Sealed type
- Standard refrigerating capacity:
- -55℃ to +125℃
- Input power:
- 220VAC/50Hz kw
- Overall dimension:
- 620mm * 1000mm * 1060mm (L * W
- Weight:
- 258 kg
- Application field:
- reliability test
- temperature:
- -80℃ to +225℃
- temperature conversion:
- Transition between-55℃ and +125℃ for approximately 10 seconds
- temperature control precision:
- ±1℃
- display accuracy:
- ±0.1℃
ThermoTSTTS780 Thermal shock machine High and low temperature shock zonglen alternative intest
The is a precision high and low temperature shock airflow meter with a wider temperature range of-80℃ to +225℃, providing strong temperature conversion testing capabilities. The temperature conversion from-55℃ to +125℃ is about 10 seconds; after long-term multi-working condition verification, it meets the requirements of various production environments and engineering environments. TS780 is purely mechanical refrigeration and does not require liquid nitrogen or any other consumable refrigerant.ThermoTSTTS780 cold shock machine High and low temperature shock zonglen alternative intest Features
The temperature change rate is fast, about 10 seconds between-55℃ and +125℃
Effective temperature range,-80℃ to +225℃
Compact, mobile design
Touch screen operation, man-machine interaction interface
Fast DUT Temperature Stabilization Time
Temperature control accuracy 1℃, display accuracy 0.1℃
Air flow up to 18SCFM
Defrost design, quickly remove internal moisture accumulation
ThermoTSTTS780 cold shock machine high and low temperature shock zonglenapplication
Product characteristic analysis, high and low temperature change test, temperature shock test, failure analysis and other reliability tests, such as:
Chips, microelectronic devices, integrated circuits
(SOC, FPGA, PLD, MCU, ADC/DAC, DSP, etc.)
Flash, UFS, eMMC
PCBs, MCMs, MEMS, IGBTs, sensors, small module assemblies
Optical communication (such as: Transceiver high and low temperature test, SFP optical module high and low temperature test, etc.)
Other electronic industries, aerospace new materials, laboratory research
testing standard
Meet the American Jun standard MILti system test standard
Meet the domestic jun component GJBti series test standard
Meet JEDEC test requirements
- Name(chinese)
- 成都中冷低温科技有限公司
- Name(English)
- Chengdu ZongLen Technologies Co., Ltd
- China credit code
- 91510107MA6D05QT67 Identity Verification
- Registered Capital
- 1,000,000 CNY
- Operating term
- 2019-10-18 ~ ****
- Address
-
Pi County, Chengdu, Sichuan, China
- Nearby port
- Shenzhen,Guangzhou
Chengdu ZongLen Technologies Co., Ltd., headquartered in Chengdu, China, is a professional pan conductor high and low temperature intelligent equipment enterprise,with refrigeration and semiconductor divisions. We have successively obtained multiple certifications and honors, including national high-tech enterprise, specialized and innovative enterprise, national level science and technology enterprise, EU CE certified enterprise, ISO9001 international quality management system certified enterprise, and intellectual property standard certified enterprise.- Name(chinese)
- 成都中冷低温科技有限公司
- Name(English)
- Chengdu ZongLen Technologies Co., Ltd
- China credit code
- 91510107MA6D05QT67 Identity Verification
- Registered Capital
- 1,000,000 CNY
- Operating term
- 2019-10-18 ~ ****
- Address
-
Pi County, Chengdu, Sichuan, China
- Nearby port
- Shenzhen,Guangzhou
Chengdu ZongLen Technologies Co., Ltd., headquartered in Chengdu, China, is a professional pan conductor high and low temperature intelligent equipment enterprise,with refrigeration and semiconductor divisions. We have successively obtained multiple certifications and honors, including national high-tech enterprise, specialized and innovative enterprise, national level science and technology enterprise, EU CE certified enterprise, ISO9001 international quality management system certified enterprise, and intellectual property standard certified enterprise. -
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